2.54 0.2 8-0.6 2.5 min 0.5 0.5 0.5 14 2.54 (=35.56) heat sink side 18 3 min 12 2-r1.6 0.28 25 4-c1.2 t ype name lot no. qr code 24 0.5 9.5 0.5 5.5 0.5 (1) terminal code 1. nc 2. v ufb 3. v vfb 4. v wfb 5. u p 6. v p 7. w p 8. v p1 9. v nc * 10. u n 11. v n 12. w n 13. v n1 14. f o 15. cin 16. v nc * 17. nc 18. nc 19. nc 20. n 21. w 22. v 23. u 24. p 25. nc 29.2 0.5 14.4 0.5 14.4 0.5 (3.5) (3.3) heat sink side 0.4 0.4 1.5 0.05 3.5 b 0.8 (2.656) (2.756) (0~5 ) (1.2) (1.2) detail a detail b 0.28 1.778 0.2 35 0.3 20 1.778(=35.56) 38 0.5 17 1 a 16-0.5 0.5 1.5 min integrated power functions 600v/3a low-loss rc-igbt inverter bridge for three phase dc-to-ac power conversion application ac100v~200v three phase low power motor inverter drive. fig. 1 package outlines (PS21961-4) mitsubishi semiconductor PS21961-4/-4a/-4c/-4w transfer-mold type insulated type integrated drive, protection and system control functions for upper-leg igbt s : drive circuit, high voltage high-speed level shifting, control supply under-voltage (uv) protection. for lower-leg igbt s : drive circuit, control supply under-voltage protection (uv), short circuit protection (sc). fault signaling : corresponding to an sc fault (lower-leg igbt) or a uv fault (lower-side supply). input interface : 3v, 5v line (high active). ? l approved : yellow card no. e80276 dimensions in mm sep. 2007 *) two v nc terminals (9 & 16 pin) are connected inside dip-ipm, please connect either one to the 15v power supply gnd outside and leave another one open. PS21961-4
mitsubishi semiconductor PS21961-4/-4a/-4c/-4w transfer-mold type insulated type sep. 2007 2 fig. 2 long terminal type package outlines (PS21961-4a) fig. 3 zigzag terminal type package outlines (PS21961-4c) 2.54 0.2 8-0.6 2.5 min 14 2.54 (=35.56) heat sink side 18 3 min 12 2-r1.6 0.28 25 4-c1.2 t ype name lot no. qr code 24 0.5 14 0.5 5.5 0.5 (1) terminal code 1. nc 2. v ufb 3. v vfb 4. v wfb 5. u p 6. v p 7. w p 8. v p1 9. v nc * 10. u n 11. v n 12. w n 13. v n1 14. f o 15. cin 16. v nc * 17. nc 18. nc 19. nc 20. n 21. w 22. v 23. u 24. p 25. nc 29.4 0.5 14.4 0.5 14.4 0.5 (3.5) (3.3) heat sink side 0.4 0.4 1.5 0.05 3.5 b 0.8 (2.656) (2.756) (0~5 ) (1.2) (1.2) detail a detail b 0.28 1.778 0.2 35 0.3 20 1.778(=35.56) 38 0.5 17 1 a 16-0.5 1.5 min 0.5 0.5 0.5 0.5 2.54 0.2 8-0.6 14 2.54 (=35.56) heat sink side 18 3 min 12 2-r1.6 0.28 25 4-c1.2 t ype name lot no. qr code 24 0.5 9.5 0.5 5.5 0.5 (1) terminal code 1. nc 2. v ufb 3. v vfb 4. v wfb 5. u p 6. v p 7. w p 8. v p1 9. v nc * 10. u n 11. v n 12. w n 13. v n1 14. f o 15. cin 16. v nc * 17. nc 18. nc 19. nc 20. n 21. w 22. v 23. u 24. p 25. nc 29.2 0.5 33.7 0.5 14.4 0.5 18.9 0.5 14.4 0.5 (3.5) heat sink side 0.4 0.4 1.5 0.05 3.5 b 0.8 detail b 0.28 1.778 0.2 35 0.3 20 1.778(=35.56) 38 0.5 17 1 a 0.4 0.5 1.5 min (0~5 ) (0~5 ) 16-0.5 0.5 0.5 (2.656) (2.756) (1.2) (1.2) detail a dimensions in mm dimensions in mm *) two v nc terminals (9 & 16 pin) are connected inside dip-ipm, please connect either one to the 15v power supply gnd outside and leave another one open. *) two v nc terminals (9 & 16 pin) are connected inside dip-ipm, please connect either one to the 15v power supply gnd outside and leave another one open.
mitsubishi semiconductor PS21961-4/-4a/-4c/-4w transfer-mold type insulated type sep. 2007 3 2.54 0.25 7-0.6 2.5 min 14 2.54 (=35.56) heat sink side 18 3 min 12 (1.8) 2-r1.6 0.28 25 4-c1.2 ty p e name lot no. qr code 24 0.5 11 0.5 5.5 0.5 (1) terminal code 1. nc 2. v ufb 3. v vfb 4. v wfb 5. u p 6. v p 7. w p 8. v p1 9. v nc * 10. u n 11. v n 12. w n 13. v n1 14. f o 15. cin 16. v nc * 17. nc 18. nc 19. nc 20. n 21. w 22. v 23. u 24. p 25. nc 35.2 0.6 29.2 0.5 14.4 0.5 14.4 0.5 17.4 0.5 17.4 0.5 (3.5) heat sink side 0.4 1.5 0.05 3.5 b 0.8 0.4 0.4 (2.656) (2.756) (0~5 ) (1.2) (1.2) detail a detail b 0.28 1.778 0.25 35 0.3 20 1.778(=35.56) 38 0.5 17 1 a 16-0.5 0.4 1.5 min (0~5 ) 0.5 0.5 0.5 m v nc z : znr (surge absorber) c : ac filter (ceramic capacitor 2.2~6.5nf) (note : additionally, an appropriate line-to line surge absorber circuit may become necessary depending on the application environment). c1 : electrolytic type with good temperature and frequency c2 : 0.22~2 f r-category ceramic capacitor for noise filtering. characteristics (note : the capacitance value depends on the pwm control scheme used in the applied system). protection circuit (uv) drive circuit cbu cbu+ cbv cbv+ cbw cbw+ ac line input input signal conditioning input signal conditioning input signal conditioning level shifter drive circuit level shifter drive circuit level shifter drive circuit input signal conditioning protection circuit control supply under-voltage protection f o dip-ipm (note 4) inrush current limiter circuit v d v nc h-side rc-igbt s l-side rc-igbt s w v u c2 c1 p n1 n cin z c high-side input (pwm) (3v, 5v line)(note 1, 2) (note 5) (note 7) (note 6) (15v line) ac line output (3v, 5v line)(note 1, 2) fault output (5v line) (note 3) low-side input (pwm) fo logic (note 6) note1: input logic is high-active. there is a 3.3k ? (min) pull-down resistor built-in each input circuit. when using an external cr filter, please make it satisfy the input threshold voltage. 2: by virtue of integrating an application specific type hvic inside the module, direct coupling to mcu terminals without any opto-coupler or transformer isolation is possible. (see also fig. 11) 3: this output is open drain type. the signal line should be pulled up to the positive side of the 5v power supply with appro ximately 10k ? resistor. (see also fig. 11) 4: the wiring between the power dc link capacitor and the p, n1 terminals should be as short as possible to protect the dip-ip m against catastrophic high surge voltages. for extra precaution, a small film type snubber capacitor (0.1~0.22 f, high voltage type) is recommended to be mounted close to these p & n1 dc power input pins. 5: high voltage (600v or more) and fast recovery type (less than 100ns) diodes should be used in the bootstrap circuit. 6: it is recommended to insert a zener diode (24v/1w) between each pair of control supply terminals to prevent surge destructi on. 7: bootstrap negative electrodes should be connected to u, v, w terminals directly and separated from the main output wires. fig. 5 internal functions block diagram (typical application example) fig. 4 both sides zigzag terminal type package outlines (PS21961-4w) dimensions in mm *) two v nc terminals (9 & 16 pin) are connected inside dip-ipm, please connect either one to the 15v power supply gnd outside and leave another one open.
mitsubishi semiconductor PS21961-4/-4a/-4c/-4w transfer-mold type insulated type sep. 2007 4 v v v v ma v 20 20 ?.5~v d +0.5 ?.5~v d +0.5 1 ?.5~v d +0.5 applied between v p1 -v nc , v n1 -v nc applied between v ufb -u, v vfb -v, v wfb -w applied between u p , v p , w p , u n , v n , w n -v nc applied between f o -v nc fo terminal sink current applied between cin-v nc control supply voltage control supply voltage input voltage fault output supply voltage fault output current current sensing input voltage v d v db v in v fo i fo v sc 450 500 600 3 6 21.3 ?0~+125 applied between p-n applied between p-n t c = 25 c t c = 25 c, less than 1ms t c = 25 c, per 1 chip (note 1) v cc v cc(surge) v ces i c i cp p c t j condition symbol parameter ratings unit supply voltage supply voltage (surge) collector-emitter voltage each igbt collector current each igbt collector current (peak) collector dissipation (rc-igbt) junction temperature v v v a a w c maximum ratings (t j = 25 c, unless otherwise noted) inverter part condition symbol parameter ratings unit control (protection) part note 1 : the maximum junction temperature rating of the power chips integrated within the dip-ipm is 150 c (@ t c 100 c). however, to ensure safe operation of the dip-ipm, the average junction temperature should be limited to t j(ave) 125 c (@ t c 100 c). note1: in the recommended external protection circuit, please select the rc time constant in the range 1.5~2.0 s. 2: to prevent erroneous protection operation, the wiring of a, b, c should be as short as possible. drive circuit drive circuit protection circuit w v u b c v nc cin a p n1 n c r shunt resistor external protection circuit dip-ipm l-side rc-igbt s h-side rc-igbt s sc protection trip level i c (a) t w ( s) 2 0 short circuit protective function (sc) : sc protection is achieved by sensing the l-side dc-bus current (through the external shunt resistor) after allowing a suitable filtering time (defined by the rc circuit). when the sensed shunt voltage exceeds the sc trip-level, all the l-side igbts are turned off and a fault signal (fo) is output. since the sc fault may be repetitive, it is recommended to stop the system when the fo signal is received and check the fault. collector current waveform (note 1) (note 2) fig. 6 external part of the dip-ipm protection circuit
mitsubishi semiconductor PS21961-4/-4a/-4c/-4w transfer-mold type insulated type sep. 2007 5 2.20 2.30 2.00 1.50 0.60 2.00 0.80 1 10 4.7 ma v t j = 25 c t j = 125 c i c = 3a, t j = 25 c i c = 3a, t j = 125 c v ce(sat) v ec t on t rr t c(on) t off t c(off) i ces condition symbol parameter limits inverter rc-igbt part (per 1/6 module) r th(j-c)q min. thermal resistance t yp. max. unit t j = 25 c, ? c = 3a, v in = 0v condition symbol parameter limits min. t yp. max. 0.50 unit electrical characteristics (t j = 25 c, unless otherwise noted) inverter part collector-emitter saturation voltage fwd forward voltage junction to case thermal resistance (note 3) v d = v db = 15v v in = 5v switching times v cc = 300v, v d = v db = 15v i c = 3a, t j = 125 c, v in = 0 ? 5v inductive load (upper-lower arm) collector-emitter cut-off current v ce = v ces 1.70 1.80 1.50 0.95 0.30 0.35 1.40 0.50 v s s s s s c/w note 3 : grease with good thermal conductivity and long-term quality should be applied evenly with +100 m~+200 m on the contacting sur- face of dip-ipm and heat-sink. the contacting thermal resistance between dip-ipm case and heat sink (r th(c-f) ) is determined by the thickness and the thermal conductivity of the applied grease. for reference, r th(c-f) (per 1/6 module) is about 0.3 c/w when the grease thickness is 20 m and the thermal conductivity is 1.0w/m?. note 2: t c measurement point dip-ipm rc-igbt chip position power terminals control terminals t c point heat sink side 11.6mm 3mm 400 ?0~+100 ?0~+125 1500 v d = 13.5~16.5v, inverter part t j = 125 c, non-repetitive, less than 2 s (note 2) 60hz, sinusoidal, 1 minute, all connected pins to heat-sink plate v cc(prot) t c t stg v iso symbol ratings unit supply voltage self protection limit (short circuit protection capability) module case operation temperature storage temperature isolation voltage v c c v rms to ta l system parameter condition
mitsubishi semiconductor PS21961-4/-4a/-4c/-4w transfer-mold type insulated type sep. 2007 6 note 7: flatness measurement position + + heat sink side heat sink side 4.6mm dip-ipm measurement position mounting screw : m3 ( note 6 ) condition parameter limits mounting torque w eight heat-sink flatness min. mechanical characteristics and ratings t yp. max. 0.59 ?0 unit 10 0.78 100 n? g m recommended : 0.69 n? ( note 7 ) note 6 : plain washers (iso 7089~7094) are recommended. control (protection) part note 4 : short circuit protection is functioning only for the lower-arms. please select the external shunt resistance such that the sc t rip-level is less than 1.7 times of the current rating. 5: fault signal is asserted corresponding to a short circuit or lower side control supply under-voltage failure. symbol i d v foh v fol v sc(ref) i in uv dbt uv dbr uv dt uv dr t fo v th(on) v th(off) v th(hys) parameter condition limits unit circuit current fault output voltage short circuit trip level control supply under-voltage protection fault output pulse width on threshold voltage off threshold voltage on/off threshold hysteresis voltage v d = v db = 15v v in = 5v t otal of v p1 -v nc , v n1 -v nc v ufb -u, v vfb -v, v wfb -w v sc = 0v, f o terminal pull-up to 5v by 10k ? v sc = 1v, i fo = 1ma t j = 25 c, v d = 15v (note 4) v in = 5v t rip level reset level t rip level reset level (note 5) applied between u p , v p , w p , u n , v n , w n -v nc 4.9 0.43 0.70 10.0 10.5 10.3 10.8 20 0.8 0.35 0.48 1.00 2.1 1.3 0.65 2.80 0.55 2.80 0.55 0.95 0.53 1.50 12.0 12.5 12.5 13.0 2.6 min. typ. max. ma ma ma ma v v v ma v v v v s v v v v d = v db = 15v v in = 0v t otal of v p1 -v nc , v n1 -v nc v ufb -u, v vfb -v, v wfb -w t j 125 c input current
mitsubishi semiconductor PS21961-4/-4a/-4c/-4w transfer-mold type insulated type sep. 2007 7 fig. 7 the dip-ipm internal circuit dip-ipm u out v out u out v vs w out v ws v out w out v no gnd fo w n v n u n v cc hvic lvic cin cin n w v u p com v ub v us v cc v vb v p v wb w p fo w n v n u n w p v p u p u p v nc v n1 v p1 v vfb v wfb v nc v ufb rc-igbt1 rc-igbt2 rc-igbt3 rc-igbt4 rc-igbt5 rc-igbt6 v v v v/ s s khz supply voltage control supply voltage control supply voltage control supply variation arm shoot-through blocking time pwm input frequency applied between p-n applied between v p1 -v nc , v n1 -v nc applied between v ufb -u, v vfb -v, v wfb -w for each input signal, t c 100 c t c 100 c, tj 125 c 400 16.5 18.5 1 20 v cc v d v db ? v d , ? v db t dead f pwm condition symbol parameter limits min. t yp. max. 0 13.5 13.0 ? 1.5 unit recommended operation conditions 300 15.0 15.0 note 8 : the allowable r.m.s. current also depends on the actual application conditions. 9: ipm might not make response or work properly if the input signal pulse width is less than the recommended minimum value. i o pwin(on) pwin(off) v nc allowable r.m.s. current allowable minimum input pulse width v nc variation v cc = 300v, v d = v db = 15v, p .f = 0.8, sinusoidal pwm, t j 125 c, t c 100 c (note 8) (note 9) between v nc -n (including surge) arms s v 0.5 0.5 ?.0 5.0 f pwm = 5khz f pwm = 15khz 2.0 1.5
mitsubishi semiconductor PS21961-4/-4a/-4c/-4w transfer-mold type insulated type sep. 2007 8 fault output fo output current ic control supply voltage v d protection circuit state control input b1 b2 b3 b4 b5 reset reset uv dt uv dr set b6 b7 protection circuit state lower-arms control input fault output fo sense voltage of the shunt resistor output current ic internal igbt gate sc reference voltage cr circuit time constant delay a5 a8 a4 a3 a1 a2 sc reset set a7 a6 fig. 8 timing chart of the dip-ipm protective functions [a] short-circuit protection (lower-arms only with the external shunt resistor and cr filter) a1. normal operation : igbt on and carrying current. a2. short circuit detection (sc trigger). a3. igbt gate hard interruption. a4. igbt turns off. a5. f o outputs (t fo(min) = 20 s). a6. input = ?? igbt off. a7. input = ?? a8. igbt off in spite of input ?? [b] under-voltage protection (lower-side, uv d ) b1. control supply voltage rising : after the voltage level reaches uv dr , the circuits start to operate when next input is applied. b2. normal operation : igbt on and carrying current. b3. under voltage trip (uv dt ). b4. igbt off in spite of control input condition. b5. f o outputs (t fo 20 s and f o outputs continuously during uv period). b6. under voltage reset (uv dr ). b7. normal operation : igbt on and carrying current.
mitsubishi semiconductor PS21961-4/-4a/-4c/-4w transfer-mold type insulated type sep. 2007 9 mcu 10k ? u p ,v p ,w p ,u n ,v n ,w n v nc (logic) fo dip-ipm 5v line 3.3k ? (min) fault output fo output current ic control supply voltage v db protection circuit state control input c6 c1 c2 c4 c5 c3 reset uv dbt uv dbr set reset high-level (no fault output) [c] under-voltage protection (upper-side, uv db ) c1. control supply voltage rising : after the voltage level reaches uv dbr , the circuits start to operate when next input is applied. c2. normal operation : igbt on and carrying current. c3. under voltage trip (uv dbt ). c4. igbt off in spite of control input signal level, but there is no f o signal outputs. c5. under voltage reset (uv dbr ). c6. normal operation : igbt on and carrying current. fig. 9 recommended mcu i/o interface circuit note : the setting of rc coupling at each input (parts shown dotted) depends on the pwm control scheme and the wiring impedance of the printed circuit board. the dip-ipm input section integrates a 3.3k ? (min) pull-down resistor. therefore, when using an external filtering resistor, pay attention to the turn-on threshold voltage. fig. 10 wiring connection of shunt resistor v nc n dip-ipm wiring inductance should be less than 10nh. shunt resistor equivalent to the inductance of a copper pattern in dimension of width=3mm, thickness=100 m, length=17mm please make the gnd wiring connection of shunt resistor to the v nc terminal as close as possible.
mitsubishi semiconductor PS21961-4/-4a/-4c/-4w transfer-mold type insulated type sep. 2007 10 fig. 11 system connection example of dip-ipm application circuit note 1 : input drive is high-active type. there is a 3.3k ? (min.) pull-down resistor integrated in the ic input circuit. to prevent malfunction, the wiring of each input should be as short as possible. when using rc coupling circuit, make sure the input signal level meet the turn-on and turn-off threshold voltage. 2: thanks to hvic inside the module, direct coupling to mcu without any opto-coupler or transformer isolation is possible. 3: f o output is open drain type. it should be pulled up to the positive side of a 5v power supply by a resistor of about 10k ? . 4: to prevent erroneous protection, the wiring of a, b, c should be as short as possible. 5: the time constant r1c4 of the protection circuit should be selected in the range of 1.5-2 s. sc interrupting time might vary with the wiring pattern. tight tolerance, temp-compensated type is recommended for r1, c4. 6: all capacitors should be mounted as close to the terminals of the dip-ipm as possible. (c1: good temperature, frequency charact er- istic electrolytic type, and c2, c3: good temperature, frequency and dc bias characteristic ceramic type are recommended.) 7: to prevent surge destruction, the wiring between the smoothing capacitor and the p, n1 terminals should be as short as possible . generally a 0.1-0.22 f snubber between the p-n1 terminals is recommended. 8: t wo v nc terminals (9 & 16 pin) are connected inside dip-ipm, please connect either one to the 15v power supply gnd outside and leave another one open. 9: it is recommended to insert a zener diode (24v/1w) between each pair of control supply terminals to prevent surge destruction. 10 : if control gnd is connected to power gnd by broad pattern, it may cause malfunction by power gnd fluctuation. it is recommended to connect control gnd and power gnd at only a point. 15v line w out v out dip-ipm c3 c2 c2 c2 c1 c1 c1 u out w p v wb v p v vb 5v line u p com u out v out w out cin v no gnd f o w n v n v cc c b a r1 n1 c4 cin n w v u p v ws v vs v us v ub v cc fo w n v n u n u n w p v p u p v nc v nc v n1 v p1 v ufb v vfb v wfb c3 mcu hvic lvic shunt resistor long wiring here might cause sc level fluctuation and malfunction. c1: electrolytic capacitor with good temperature characteristics 0.22 ~ 2 f r-category ceramic capacitor for noise filtering c2,c3: long gnd wiring here might generate noise to input and cause igbt malfunction. long wiring here might cause short-circuit. long wiring here might cause short-circuit failure. m m bootstrap negative electrodes should be connected to u, v, w terminals directly and separated from the main output wires.
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